Server/Storage

Server(1)

Server backpanel Board

PCB Layer Count: 24L

Technology: Through hole with VIPPO for Server

Material: FR4 Tg 170℃ with ultra low loss

Surface Finish: OSP

R-C(1)

Communication Board

PCB Layer Count: 6L

Technology: Through hole

Material: FR4 Tg 150℃

Surface Finish: ENIG

md_QQ截图20121206173023(1)

Storage Board

PCB Layer Count: 8L

Technology: HDI 1-6-1 laser via 125um with copper filling

Material: FR4 Tg 150℃

Surface Finish: ENIG

NB(1)

NoteBook Board

PCB Layer Count: 12L

Technology: Through hole

Material: FR4 Tg 170℃ with low loss

Surface Finish: OSP

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