With the advent of the Internet of Things era, global terminal electronic products are gradually moving towards multifunctional integration and low-power design, which has attracted increasing attention to SIP technology that can integrate multiple bare crystals into a single package. In addition to existing packaging and testing giants actively expanding SIP manufacturing capacity, wafer foundries and IC substrate factories are also competing to invest in this technology to meet market demand.
Earlier, Apple released the latest Apple Watch watch, which uses SIP encapsulated chips, adding a lot of color to the new watch in terms of size and performance. The development of chips has shifted from blindly pursuing power consumption reduction and performance improvement (Moore’s Law) to more pragmatic meeting market demands (surpassing Moore’s Law).
This article analyzes the SIP packaging process from five aspects, so that everyone can understand the true purpose of SIP packaging.
1、 SIP product packaging introduction
What is SIP?
The SiP module is a fully functional subsystem that integrates one or more IC chips and passive components into one package. This IC chip (using different technologies such as CMOS, BiCMOS, GaAs, etc.) is a wire bonding chip or Flipchip chip, mounted on a Leadfream, Substrate, or LTCC substrate. Passive components such as RLC and filters (SAW/BAW/Balun, etc.) are integrated into a module in the form of separate passive components, integrated passive components, or embedded passive components.
When is SIP adopted?
When the product has more and more functions, and the layout of the circuit board is limited, making it impossible to design more components and circuits, designers will integrate the functions of this PCB board, along with various active or passive components, on a single IC chip to complete the design of the entire product, that is, SIP application.
1. Small size
In terms of the same functionality, SIP modules integrate multiple chips together, which can save more space on PCBs compared to independently packaged ICs.
2. Fast time
The SIP module board is a system or subsystem, which can be used in a larger system. The prediction and preliminary review can be completed faster in the commissioning phase.
3. Low cost
Although SIP modules are more expensive than individual components, the reduction in PCB space, low failure rate, low testing costs, and simplified system design result in a reduction in overall costs.
4. High production efficiency
By integrating and separating passive components through SIP, the defect rate is reduced, thereby improving the overall product yield. The module adopts advanced IC packaging technology to reduce system failure rate.
5. Simplify system design
SIP integrates complex circuits into modules to reduce the complexity of PCB circuit design. The SIP module provides quick replacement functionality, making it easy for system designers to add the required features.
6. Simplify system testing
The SIP module has been tested before shipment to reduce the testing time of the entire system.
7. Simplify logistics management
The SIP module can reduce the number of items and quantities required for warehouse stocking, simplifying the production process.
SIP process flow division
The SIP packaging process can be divided into two types based on the connection method between the chip and the substrate: wire bonding packaging and flip chip soldering.
Lead bonding packaging process