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Process flow of DBC, AMB and DPC copper clad ceramic substrate

Copper clad ceramic substrate is a substrate that combines copper materials on the single/double surface of ceramic substrate through special processes. It is widely used in power semiconductor products, second only to chips in importance, and is one of the core packaging materials for high power and high heat dissipation products.

According to the process, the ceramic copper clad plate can be generally divided into: DPC (direct electroplating ceramic substrate), DBC (direct copper clad ceramic substrate) and AMB (active metal brazing ceramic substrate), which have excellent functions such as conductive interconnection, electrical insulation, heat dissipation channel and mechanical support. DBC and AMB are widely used in power semiconductors.
Ceramic substrate
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  •  DPC ceramic substrate
DPC mainly uses evaporation, magnetron sputtering and other surface deposition processes to metallize the substrate surface. First, titanium is sputtered under vacuum conditions, then copper particles are sputtered, finally, the plating is thickened, then the circuit is fabricated by ordinary PCB process, and finally the thickness of the circuit is increased by electroplating/electroless plating deposition. Generally, the copper clad plate needs to print more dense lines, punch holes, etc., and the line production is more precise. Generally, the coating thickness is generally 1um~10um, and the adhesion of copper layer is 8~15n/mm.

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Figure DPC Process Flow
  • DBC ceramic substrate
DBC is a process of directly bonding copper foil to ceramic substrate. The advantages lie in its high thermal conductivity, high insulation performance and high reliability. Ceramic substrate has excellent heat conduction performance, which can effectively transfer the heat generated by the device to the radiator, thus ensuring the stability and life of the device. The ceramic substrate DBC process also has high reliability, which can ensure the stability and reliability of devices in long-term use.

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Figure Basic Process Flow of DBC
  • AMB ceramic substrate
AMB ceramic copper clad plate uses AMB active brazing process to make copper, and the bonding force of copper layer is higher than that of DPC, which is more than 18n/mm, and higher than 21n/mm. AMB ceramic copper clad plate usually has high bonding force, and the copper is usually thick, between 100um and 800um. Generally, there are few lines or holes. Even if there are lines, they are very simple, and the spacing is relatively wide.
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Figure AMB Basic Process Flow
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